1. Solder the two pieces together.

2. Fewer workers are needed to solder circuit boards.

3. They make a qualitative judgment on whether the solder joint is acceptable or unacceptable.

4. Some joins. such as the fine solder work required for gold filigree and granulation, can not be seen even at high magnification.

5. Quality control of solder joints is currently done by blowing up a digitized image of the joint and having humans inspect it.

6. Note the solder tag at one of the T1 fixing lugs.

7. The tin lead soft solder used on the ewer is very dense to X-rays and appears as white patches on the radiograph.

8. I loved the metallic smell of solder as it dripped in small puddles, hardening on the workbench before me.

9. Iron, tin melting furnace, the solder wire.

10. Less residue, shinny and clean solder spot.

11. An ideal connection that puts any solder to shame.

12. Solder resist also provides some protection from the environment.

13. If copper is used, it is okay to solder.

13. is a online sentence dictionary, on which you can find good sentences for a large number of words.

14. Leave solder paste for 4 hours at room temperature before use. Unseal solder paste be stored 24 hours in room temperature .

15. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

16. If too much solder is use, it may flow past tube and clog seating area.

17. The heavy brown furniture, and Senor Menini: his eyepiece, the solder in his teeth, his dusty scales.

18. We were disappointed when we were marked as having correctly classified only 32 solder joints out of the 34.

19. Flexible copper pipes are supplied with plain ends, with solder ring fittings or with tap connectors.

20. This means there will be some exchange between the solder and the metal which will alter the composition of both.

21. The main difference between the two is the melting point of the solder.

22. Use a similar hooked connection to attach the Earth wire and the wire leading from S1 to the solder tag.

23. With capillary fittings, you can use a blowlamp to melt the solder.

24. Nitrogen protection can improves wettability of lead - free solder and solder joint quality.

25. A medium-sized cylindrical connector featuring quick bayonet coupling, crimp, solder, or printed circuit board termination. It offers seven mounting styles and ten shell sizes.

26. All foot machine, automatic machine PC board feet cut, cut legs pushing machines manually solder equipment, hand Baptist tin stoves, printer, Tool Grinder.

27. At the end of the nineteenth century BCE an ambitious solder called Shamshi- Adad brought Ashur under his control.

28. When handling the PCB or PCBA, is the operator wearing gloves if PCB solder side is touched ?

29. This superior reliability comes from advances in packaging techniques and epitaxial structure, together with the use of hard solder construction.

30. Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.

31. In this paper a maskless bumping technique to create thin solder caps will be show.

32. Use only with production equipment specifically designed for use with solder paste.

33. In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

34. Familiar with assemble line, potting machine , wave solder machine and fixture.

35. Methods of SMT solder reflow, wave-soldering and manual soldering are presented in this paper.

36. In order to overcome the error alarming and unintelligence of the automatic optical inspection(AOI) system for the solder joint inspection, a new inspecting method based on neural network is proposed.

37. Estimates are that 60-70% of printed wiring boards are tin-lead solder coated, usually by hot air solder leveling (HASL).

38. Weld, braze, cement, solder and thread joints to join pipes and fabricate sections of piping system.

39. There is found that crack at Intermetallic Compound when mixed solder with Lead Free Solder and Lead Solder.

40. Electromigration Induced Cu Dissolution in Flip Chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.

41. Apparently these plastic spools flip open and shut to dispense and protect the solder wick; just take out the wick and wrap your earbuds around the spool instead.

42. It includes No - Pb solder, cleaner, solder wire for aluminum and no - cleaning flux.

43. Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.

44. Manual solder equipment, hand Baptist tin heater Tool Grinder, hands and feet all aircraft.

45. A lead-free hard solder material is a kind of lead-free alloy.

46. Careful tinning of the ends of wires results in a better joint when you solder them.

47. Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.

48. Used in the masking operation during wave solder process on PCB.

49. Then reheat the solder cup of the fitting to draw up the alloy.

50. In the modern automotive industry, extensive use of spot-welding in the body, the solder joint failure is the main reason leading to vehicle failure.

51. We should the adhibit of solder paste before screen printing by automatic machine or by hand.

52. Application: Apply to all kinds of solder wire with lead or lead - free.

53. Solder Mask or Solder resist: Coating to prevent solder to deposit on.

54. Atoms in the solder joints move as a result of both diffusion and electromigration.

55. The mechanics of making both the solder joint and the brazing joint are comparatively similar.

56. The solder joint exceeds the strength of Type L tube in annealed temper.

57. In the surface mounting technology, the result of the solder printing is very big to the product quantity.

58. Thermal fatigue life of solder joints is predicted using the Coffin - Manson's empirical modified formula.

59. Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.

60. It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.

61. Molten solder droplet bumping (MSDB) is adapted to the requirement of high-density packaging and has distinctive advantages.

62. The outgas from the solder mask had a negative influence on the bondability. Plasma cleaning was effective in removing the organic contaminants.

63. The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.

64. PWB samples were subjected to the solder float test per MIL-P-55110 and then the PTHs were cross—sectioned.

65. Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

66. Relay. Coil voltage 48 VDC. Contact arrangement 2C . Terminal solder. Enclosure standard. Option neon lamp.

67. The solder resist prevents solder from bridging between conductors and thereby creating short circuits.

68. The solder had barely cooled from my first crystal set, when I started in on the second.

69. On studying of electromigration on lead-free solder joints, the theories and the current studies on electromigration have been introduced firstly.

70. Reflow solder paste in 2 hours as soon as possible after printing.

71. Used with the solder wire together, soldering a stainless steel etc metal.

72. In some cases it may be necessary to connect metal surfaces by means of a hard spelter solder which fuses at hight temperature.

73. This reference manual contains critical acceptance criteria for through - hole solder joints from the IPC - A - 610 D.

74. Design a automatic scanning system for the solder joint's ultrasonic detection by using advanced motion control technology in the system of the solder joint's ultrasonic detection.

75. Stems shall be of dezincification-resistant silicon bronze ASTM B 371 or low-zinc alloy B 99 non-asbestos packing and malleable or ductile iron handwheel. Valve ends may be threaded or solder type.

76. Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co- planarity .

77. Is there a way to control the thick of the printed solder paster?

78. To solder(two pieces of metal) together using a hard solder with a high melting point.

79. Tin - lead solder in the manufacture of professional audio equipment.

80. Of greater value to the stencil designer is the area ratio,(/solder.html) which can be related directly to eventual solder paste release.

81. The infusible matters in the center of 45AgCuZn solder are one of the primary defects that affected seriously the usability, so the scanning electron microscope is used to analyze them.

82. All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.

83. The solder style ZWB 999's may be installed without disassembly, saving costly installation time.

84. Relay. Coil voltage 48 VDC. Contact arrangement 2C . Terminal solder. Enclosure standard. Option test button.

85. Tinplate has the strength and formability of steel combined with the noncorrosive and nontoxic properties of tin, and additionally is easy to solder.

86. The wetting layer may be substantially subsumed in the high content solder forming an intermetallic compound layer.

87. Joints between reinforcement members can be made satisfactorily with tin solder.

88. And techniques to make free solder bumping with electroplating are illustrated.

89. Repairing an air conditioner Freon leak involves welding silver solder around the holes in the refrigeration pipes.

90. Safe and reliable, by the automatic flash welding solder welding, welding uniform.

91. Is the time recorded when the solder paster is taken out from the storage case?

92. Weld cannot have empty solder, leakage solder, solder to wear, head of welding wire of stomatic , remain, burr, need polish fruity: Ying Guangjie of tube wall surface is flowing, feel is fluent.

93. X Armature windings that show evidence of having thrown solder without being repaired are not acceptable.

94. The mechanism for this phenomenon is caused by differences in solder solidification, which is affected by the lead from either the PCB or component lead plating.

95. Strip steel but deep treatment is canal of cold belt, solder, cold curved bar to wait.

96. The products of the company are widely applied in war industry, electronic industry, PCBA surface mounting lead-less solder pallet fixture, watercraft industry, air craft industry, etc.

97. Solder end valves are limited by temperatures which affect the strength of the solder joint.

98. Specific modular units including tin - lead solder being used in special professional equipment.

99. Used in the masking operation during wave solder process on PCB, prevented liquid immersing and polluting.

100. The circuit board comprises a dielectric layer, a circuit layer and at least one electricity-conducting joint pole and a solder mask.

101. A silver solder, placed between the segment and the core, is heated above the melting point to bond the segment to the core.

102. Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.

103. We have a special coating melt another slot for customers to purchase, according to the test, the molten melt trough trough durable than the standard 5-fold,(http:///solder.html) applied to lead-free and tin-lead solder.

104. Solder surfaces and parts produced no white erythema shape residues, High surface insulation resistance.

105. Rear - mounted designs are available with either solder cups or PCB solder pins.

106. Interface void damage is the failure characteristic of solder joint under temperature cycling.

107. BOWE Broadway bathroom supply kitchenware industry-specific silver electrode, silver wire, low-temperature welding, silver solder powder, silver paste.

108. The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.

109. The second section will introduce the new slide valve and its application in Solder Paste process.

110. The different temperature generates the difference of atomic fluxes and IMCs growth rates at the cathode, which also causes the nonuniform electromigration degree in different solder joints.

111. Nowadays, the approach to treating spent solder stripper includes neutralization, chemical sediment, electrolysis and so on.

112. The exposed corner of the PCB was slightly delaminated due to combustion of resin from the fibreglass matrix, but most of the solder joints in the area appeared to be intact.

113. So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.

114. The solderability of benzimidazole films on the surface of copper is investigated by solder float test. Several factors which influence solderability of the films are discussed.

115. The reliability of solder interconnections is dependable on the dynamic response of the board-level package.

116. Do the supplies use magnifying glass to full check PCB solder connections?

117. Transducers used in professional loudspeaker systems, using tin - lead solder.

118. The quality of solder joint affects the reliability of the products produced by SMT directly.

119. The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.

120. Through inspection of MSDB process, it can be found that initial temperature of solder droplet is the main influential factors for reliable bump.

121. Our products produce excellent sealing and connecting performance with high mechanical strength. They can be welded to various kinds of hard solder, such as gold, silver and copper.

122. Also, DSC is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate, especially for the strain concentrating area around the solder joints.

123. The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.

124. At least one molding compound is formed and the molding compound, the first patterned solder resist layer and the second patterned solder resist layer are separated.

125. The results show that silver based electric materials ought to be smelted by graphite crucible, the clay crucible is suitable for smelting silver based solder.

126. RTI remote terminal interface. 10 % to 35 % clock duty cycle. Lead finish solder.

127. Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques.

128. The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.

129. The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .

130. HOT BARThe hot wire is widely used in welding, solder reflow soldering.

131. Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.

132. The aluminum solder paste has been used in the welding of Al-Al, Al-Al alloy and Al-stainless steel.

133. The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.

133. is a sentence dictionary, on which you can find nice sentences for a large number of words.

134. Assembles pipe sections , tubing and fittings , using screws , bolts, solder, plastic solvent, and caulking.

135. The protective technology of solder coat in production of multilayer printed circuit board is introduced.

136. Now, because HASL uses plumbic solder, many people think that its craft will be eliminated, replaced soon.

137. Do not use any warming device to heat up the solder paste.

138. This letter is to inform you that we have lately obtain a patent for an improved method of aluminum solder.

139. PCBs are transported by a conveyor system over the preheat, solder and cooling stations.

140. Transition fittings are available for adapting to new or existing threaded or solder joint ends.

141. AIM produces all the needed raw materials for it's solder products including powder, mediums and core wire flux.

142. This paper discusses the solder printing process technological key points and the common breakdown problem solution.

143. The ameliorative conditions of the supersonic atomizing equipment of producing lead - free solder powder are found.

144. Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.

145. The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.

146. Therefore, it is necessary to study the reliability of this mixed solder joint.

147. Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.

148. With the miniaturized and lead-free development of electronic products, higher demand is put forward about solder.

149. With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.

150. Solder paste, screen printing, use ways, printing process course will decide the printing quality.

151. A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.

152. The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.

153. It is here that is sold cut-rate (se solder), it is the case to say, this something knotted in question.

153.

154. You can remove the key from T10s and solder an ON-OFF switch in this place.

155. The research on element interdiffusion , reaction and microstructure at the interface of solder joints is vital to the study of lead free solder joints reliability.

156. Areas that should not be soldered to may be covered with a polymer solder resist (solder mask) coating.

157. Strip the cable as shown at left. Soft solder the center conductor.

158. Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48.

159. There exists a lowest temperature, reliable MSDB bump can be achieved only when initial temperature of solder droplet is above this temperature.

160. Are AOI/ AXI complementary methods, which include solder joint inspection, used for all reflowed parts?