1. Electroless nickel-plated cylinders, chromium-plated piston rods.

2. Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in nickelbath.

3. The assembly shall have a electroless nickel plated tubular copper body.

4. Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.

5. Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.

6. Electroless copper depositing processess are controlled by the kinetics of formaldehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.

7. This paper is mainly described the exhausted electroless nickel solution regeneration by adoptingsoluble calcium salt as lactic acid is complexant, hypophosphite is reducer.

8. The corrosion resistance of direct electroless nickel on die-cast aluminum case of the electronic connector is bad.

9. Electroless plating of nickel is an advanced metalizing PZT ceramic technology. Adhesion of nickel is a key quality factor of the electrode layer.

10. The optimal process conditions of electroless lead plating on the surface of polyacrylonitrile fiber matrix are studied.

11. After oxidation treatment, the flake graphite powders were electrolessly copper plated followed by electroless silver plating.

12. The influence factor on low - phosphorous electroless nickel plating is studied.

13. The electroless nickel planting had application very widely for its corrosion-resistant and fretting-resistant and homogeneous nickel-plate.

14. Among the modified coatings, electroless plating tin has attracted a wide range of attention because of stable solution, simple operation and better solderability.

15. The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.

16. The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.

17. Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.

18. It is showed the anti-infrared capacity of the electroless nickel plating mica powder is more than the mica powder's.

19. Metals suitable for electroless metal plating on fabrics are copper and nickel.

20. Is dummy - plating performed as part of the start-up procedure before electroless copper plating product?/electroless.html

21. The effect of maleic acid, potassium ferrocyanide and thiourea on electroless copper plating was investigated.

22. Wood is one of the important regenerated natural resources. Good electroconductivity and decoration of metalized wood are realized by the method of electroless plating.

23. Metal plating was carried Out hi a three step electroless plating process.

24. A continuous and uniform nickel coating layer has been obtained on thesurface of carbon fiber (CF) and flake graphite (FG) by electroless platingtechnique.

25. In addition, the paper made preliminary step discuss on the mechanism of stability of bath on the thermodynamic and dynamic aspects and electroless composite codeposition using nano powder.

26. Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.

27. Magnetic cobalt - boron alloy deposits were prepared by electroless plating.

28. Iron - nickel - phosphorus - boron quaternary alloy electroless plating on copper panel was described.

29. Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium.

30. Treating on PET fabric using alkali andof concentration sensitize and activation solution to electroless process.

31. Piston Rod: Hardened electroless nickel plated corrosion resistant, durable low wearing surface.

32. The electroless plating technology as one kind of metallizing of material, which was widespread application of preparing various electromagnetic shielding materials.

33. Composite powder for electroless nickel plating on copper matrix was prepared by means of hydrazine reduction.

34. Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.

35. Electroless nickel plated brass needle and stem, anodized aluminum body, Buna-N seals.

36. Black spot, air bubble and scaling are usally produced during electroless nickel plating of computer hard disk drivers at the contact site with rack.

37. Output Shaft: Hardened electroless nickel, corrosion and wear resistance, oversize diameter for increased strength and rigidity.

38. All four preferred electroless baths use hypophosphite as a reducing agent.

39. Formula with Rochelle salt as the complexing agent and formaldehyde as the reducer for electroless copper deposition resulted in deposition with better washing property.

40. The test terminal is constructed with an electroless plated layer formed on the test terminal.

41. A new methane sulfonic acid electroless tin plating technology aras investigated.

42. Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.

43. The extra-thin copper film wrapped diamond nanoparticles were prepared by using electroless plating method under the condition of tin chloride sensitization and palladium chloride activation.

44. Wood material is treated with electroless plating, and the preparation of wood electromagnetic shielding material is regarded as a new type material for eliminating electromagnetic pollution.

45. The experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with the solutio...

46. The Ni-Cu coating was deposited on the surface of carbon fiber fabric by electroless plating process to prepare a new passive jamming material.

47. The effect of nickelous sulfate and hydrazine on thickness and appearance of electroless tin coatings were studies by electrochemical methods.

48. Firstly, the alloy was treated by stannate conversion treatment, and then electroless nickel plating was carried out on the conversion film.

49. Regeneration of electroless Ni bath by electroosmosis was tentatively investigated through static electroosmosis experiment.

50. It is of great significance to fast weld and repair damaged parts in electroless and gasless field.

51. The emphases are given upon the development of nobel metal plating,[http:///electroless.html] electroless plating and functional coatings on electronic devices at home and abroad.

52. The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc.

53. Formula of iron - nickel - phosphorus - boron quaternary alloy electroless plating was optimized so as to obtain amorphous deposit.

54. The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.

55. The traditional non-solvent epoxy glass flake coating was modified by self-made electroless Ag flake graphite and the glass flake conductive coating was prepared.

56. Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.

57. Silver - coated carbonyl iron powder was prepared by using electroless plating method.

58. Process specifications were discussed. The affecting factors on electroless Cu plating were briefly introduced.

59. Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated.

60. Electroless plating method is applied to metallize the AlN sbstrate.

61. The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.

62. Electroless nickel plating is introduced to metallize the optical fiber probe.

63. In this article, different solution analysis methods are compared , a quick and series measuration of sodium hypophosphite and stannum(II) ion in electroless tin bath is found out.

64. The electroless Sn Pb alloy plating process in methyl sulfonic acid system was studied.

65. The existing bath analyzing methods are compared, as a result a quick and continous method for determining sodium hypophosphite and stannum(II) ion in electroless tin bath is determined.