1. This curable materials could be used in organic encapsulant.

2. Used as a general purpose encapsulant that has excellent adhesion to a wide variety of substrates.

3. Also(http://), an encapsulant is formed in a dome shape inside the side wall.

4. It is useful, for example, as an encapsulant for semiconductor products.

5. DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.

6. The encapsulant includes an inner lens and an outer lens, the inner lens having a refractive index less than, and in some cases about 70 to 80% of, the refractive index of the outer lens.

7. The invention also provides a method for fabricating an encapsulant material.

8. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

9. An LED light source includes an LED emitter and an encapsulant that at least partially surrounds the emitter.

10. The backing sheets of the current invention possess excellent weather resistance, heat resistance, color retention, adhesion between layers and encapsulant, and scratch resistance.

11. The author recommended the design and manufactures of fixture for leakage-stoppage under stress, the encapsulant 's choice and the application in the chemical plant in the article.

12. This machine adopt stainless steel material quality and peculiar encapsulant but multiple functions making filters oil machine.

13. Pot life is the useful life of an underfill encapsulant after it is removed from the freezer and thawed, typically determined by the ability to dispense uniform quantities at uniform speeds.

14. The thermal and mechanical properties of the modified epoxy encapsulant were introduced.

15. It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.